A Review of the Problems and Impacts Related to Network Voids in Wireless Sensor Networks
In this research paper, an exploratory study has been conducted to understand the various aspects of the network void problem. This paper provides insights into multiple research questions, which include how and why each void problem occurs. We have covered ten void problems (i.e., Coverage Voids or Holes, Routing Voids or Holes, Jamming Voids or Holes, Sink/Black Holes/Worm Holes, Trap Coverage, Energy Void or Hole, Joint Coverage Problem, Sleep wake-up Problem, Barrier Coverage Problem and Coverage Restoration Problem) and their definitions to understand how each problem affects the network performance, as well as the methods, approaches and algorithms used in preventing, defending and avoiding void problems. In the last section, future recommendations are presented for a complete solution to overcome the maximum number of issues out of the set of problems above. All information has been illustrated using a tabular summary format with analysis and insights.
Keywords: Coverage Voids, Network Coverage, Energy Void, Routing Void, Wireless Sensor Networks
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ABOUT THE AUTHORS
Sanam Preet Kaur
Sanam Preet Kaur was born in Jammu. She received the B.Tech degree in Electronics and Communication Engineering from Chandigarh Engineering College, Landran (Mohali) in 2011. She is currently pursuing M.Tech in Electronics and Communication Engineering from CGC College of Engineering, Landran (Mohali).
Manvinder Sharma
Manvinder Sharma obtained his Bachelor’s degree in Electronics and Communication Engineering from Punjab Technical University. Then he obtained his Master’s degree in VLSI design from Amity University, Noida. He is a Assistant Professor at the Faculty of Electronics and Communication Engineering, CGC College of Engineering, Landran (Mohali). His specializations include Wireless Communication, VLSI Deign, 3D-ICs, Flip chip and Interconnects, Reliability of interconnects. He did his research work from Nanyang Technological University, Singapore in 3D-Ics. He is a member of IET.
Sanam Preet Kaur
Sanam Preet Kaur was born in Jammu. She received the B.Tech degree in Electronics and Communication Engineering from Chandigarh Engineering College, Landran (Mohali) in 2011. She is currently pursuing M.Tech in Electronics and Communication Engineering from CGC College of Engineering, Landran (Mohali).
Manvinder Sharma
Manvinder Sharma obtained his Bachelor’s degree in Electronics and Communication Engineering from Punjab Technical University. Then he obtained his Master’s degree in VLSI design from Amity University, Noida. He is a Assistant Professor at the Faculty of Electronics and Communication Engineering, CGC College of Engineering, Landran (Mohali). His specializations include Wireless Communication, VLSI Deign, 3D-ICs, Flip chip and Interconnects, Reliability of interconnects. He did his research work from Nanyang Technological University, Singapore in 3D-Ics. He is a member of IET.
